Wafer dicing is the procedure by which pass on isolated from a wafer of semiconductor following the handling of the Wafer. The dicing procedure can include scribing and breaking, mechanical sawing, or laser cutting. All techniques are regularly mechanized to guarantee exactness and accuracy. The dicing procedure is the individual silicon chips represented into chip bearers, which are then reasonable for use in building electronic gadgets.

During dicing, wafers are mounted regularly on dicing tape, which has a clingy backing that holds the Wafer on a slim sheet metal edge. Dicing tape has various properties relying upon the dicing application — Uv reparable tapes utilized for littler sizes and non-UV dicing tape for bigger kick the bucket sizes. When a wafer has been diced, the pieces left on dicing tape alluded to as bite the dust, bones, or kicks the bucket. Each will be bundled in a reasonable bundle or set straightforwardly on a printed circuit board substrate as an "uncovered bite the dust." The zones that have been removed, called bite the dust lanes, are commonly around 75 micrometers wide. When a wafer has been diced, the bite the dust will remain on the dicing tape until they are extricated bypass on taking care of hardware, for example, a bite the dust bonder or kick the bucket sorter, further in the gadgets get together procedure.

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